The war for the most powerful processor is something that is very present in the computer world. There is more competition in the field of smartphones if we look at all the companies, both third-party and proprietary, that develop their own chips, where Google is one of them that has entered recently. And it is with that that we begin with the expected arrival of the Google Tensor 3 chip about which more details have been leaked.
More power for the nine-core Google Tensor
As a common user, you may only need to look at the price to buy a mobile, but we are sorry to inform you that before doing so, you should have a look at its features. And one of them is the processor, the brain of any device that determines its capabilities as a whole. It is a fact that we will always see the best devices in the highest range, as is the case with the Google Pixel 8, which will receive the Google Tensor G3 this year.
It is precisely about this processor that we have learned more details through SamMobile, where they have detailed what it will be capable of. It turns out that the folks at Mountain View will be relying on ARM technology to launch their devices. In the processing part, we will have no less than 9 cores distributed among the high-powered 3 GHz cores, four more balanced 2.45 GHz cores, and two more efficient 2.15 GHz cores.
in great shape
That’s why the data flow will be more or less depending on the demands of the applications, but a phone is a multimedia device and that’s where a graphics processor or GPU comes in handy. From what they say, the Google chip will bring the best of ARM, which is a 10-core Immortalis-G715 chip that will bring unparalleled graphical improvements. In fact, it is expected to be capable of encoding and decoding 8K videos at 30fps in H.264 and HEVC formats.
But as we told you, Google will decide other aspects of the Tensor G3 terminal and one of them seems to be the use of a new storage system. Notably, we could be in front of the first device that uses a UFS 4.0 storage chip that improves writing and reading of stored data.
All of this will come within a 4nm fabrication, so it will be a real space saver for boards that house most of the accessories used by the device.
